Material Strength and Applied Mechanics: Proceedings of the 7th International Conference (MSAM 2024), Gyor, Hungary, 29 July-1 August 2024, 1st Edition

Material Strength and Applied Mechanics: Proceedings of the 7th International Conference (MSAM 2024), Gyor, Hungary, 29 July-1 August 2024, 1st Edition
Summary
Intro -- Title Page -- Preface -- About the Conference -- Contents -- Strength of Materials -- A Novel Approach to Estimate Creep Rupture Life of the Co-Ni-Cr-W-Fe-Mn Superalloy by Multi-Station Compressive Creep Tests -- Microscopic Characterization of Adiabatic Shear Bands in Additively Manufactured 316L Stainless Steel Hat-Shaped Specimens -- Fatigue Life Improvement by Reducing Welding Residual Stress with Local Heating for Steel Bridge Members -- Probabilistic Topology Optimization of Steel I-Beam Web Configurations Under Varied Load Positions -- Investigation of the Vertical Stability of Embedded Rail Structures -- Finite Element Modelling of Polymer and Crumb Rubber Modifed Asphalt Mixtures -- Numerical Simulation to Assess Cutting Tool Wear During Sheet Metal Blanking -- Discrete Element Modelling Analysis of Particle Breakage Criteria in Direct Shear Tests -- Truck Load Positions Effect on Dynamic Behavior of Fractured Steel Box Girder Bridge -- Mechanical Properties of Acid Activated Metakaolin -- The Effect of Rectangle Shaped Cutouts of Corrugated Paperboard Packages on Compressive Strength of Boxes -- DEM Analysis of Ballast Particle Direct Shear Tests: Exploring the Influence of Varying Particle Size Distributions on Shear Stress -- Strengthening RC Slabs with CFRP Bars Using the Plastic Limit Method to Control Plastic Deformation -- Predicting Natural Frequencies of a Cantilever Using Machine Learning -- Non-Square Inverse Function Jacobians in Controlled Multibody Systems: Numerical and Application Examples -- Assessing the Performance of Machine Learning Algorithms in Predicting Buckling Moments of Corrugated Web Beams -- Benchmark Analysis of Plastic Strain-Based Lifetime Estimation Fatigue Models in Aspect of SMD Component Standoff Height.